Fully automated wafer inspection for semiconductor and MEMS industries
Published on : Thursday 16-04-2020
FRT GmbH has introduced the MicroProf® DI to the market recently.

At the production site in Bergisch Gladbach, the tool is developed to solve high-precision optical surface metrology and inspection tasks for semiconductor applications. With the MicroProf® DI, FRT GmbH offers a defect inspection tool with singleshot module, step camera and high-precision microscope station, as well as comprehensive multi-sensor metrology with different topography and layer thickness sensors. The determination of defects down to sub-μm range can be performed fast and reliable. The optical inspection tool MicroProf® DI enables to inspect structured and unstructured wafers during the entire manufacturing process. By combining 2D inspection and metrology, the MicroProf® DI provides measurement solutions for a variety of applications, including defect inspection and wafer-level metrology.
MicroProf® DI provides the following advantages:
- Reliable platform, including highly flexible software
- Development and qualification of new customer processes
- Mmodules that can be flexibly combined on the same tool platform, and
- Covering all wafer surfaces at high throughput for efficient process control.
The tool provides high throughput and perfectly fits in any HVM wafer fab. The core component is the worldwide established multi-sensor tool MicroProf® 300. It allows both the measurement of wafers at different process steps and – by using hybrid metrology to enhance the precision of measurements on samples where a single sensor or measuring principle is just not enough.
The defect inspection software provides effective visualization, versatile processing and fast generation of wafer maps as well as precise quantification and comprehensible documentation of defects.
The unique MicroProf® DI combines metrology and inspection in one flexible tool.
FRT GmbH, Germany. Tel: +49 (2204) 842430. Email: [email protected]