Industrial Automation Magazine India

DIPIPMTM (Dual Inline Package Intelligent Power Module)

Published on : Tuesday 30-11--0001

Outline

DIPIPMTM (Dual Inline Package Intelligent Power Module) is a high performance IPM used primarily for consumer use inverters with the advance of next generations using mounted chips or transfer mold construction, products from Ver. 4 provide even smaller size by using high thermal conductivity insulation sheets.

Mounting a high voltage IC (HVIC) with a built-in high voltage level shift circuit enables direct input of an input signal from the microcontroller, without using a photo coupler. Further mounting a bootstrap circuit allows operation of an independent power supply for the IGBT drive of the upper arm (P side) of a 3-phase inverter connection.

In addition to our main product Version 6, we offer a lineup that includes SLIMDIPTM for consumer electronics, DIPIPM with built-in SJ-MOSFET, and the DIPIPM+TM for small industrial equipment.

Main Applications

• Air conditioners/Washing machines/Refrigerator/AC servo/General-purpose Inverters /Small size motor control

Features of SLIMDIP series

• RC-IGBT*1 having a FWD*2 built into an IGBT inside.
• Extends maximum operational case temperature (Tc)*3 from 100°C to 115°C.
• Reduces external size*3 by approximately 30% versus former products.
• Analog signal output for IC temperature and over temperature protection install.
• BSD*4 for P side drive power supply generation built in.
• GND terminal for P side drive power supply built in.

    *1 RC-IGBT: Reverse conducting IGBT

    *2 FWD: Free Wheeling Diode

    ? A diode for commutating the load current

    *3 In comparison to super mini DIPIPM series from our company.

    *4 BSD: Bootstrap Diode

    ? A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

Features of DIPIPM with built-in SJ-MOSFET series

• SJ-MOSFET (super junction MOSFET)*1 inside
• Reduces ON voltage at low current by approximately 80% in comparison to IGBT*2.
• In the same way as IGBT, assures electrification capability at high load.
• External size and pin configuration are interchangeable with super mini packages from our company *3
• Mounts a BSD*4 for P side drive power supply generation.
• Supports air conditioners in 2.2kW~8.0kW capacity range.

    *1 SJ-MOSFET: Super Junction Metal Oxide Semiconductor Field Effect Transistor

    ? A high withstanding insulated gate field effect transistor with lower loss than former

    ? MOSFET, for improving the trade-off between element withstanding and ON resistance.

    *2 In comparison to super mini DIPIPM Ver. 6 (15A/600V)

    *3 Super mini DIPIPM Ver. 6 series

    *4 BSD: Bootstrap Diode

    ? A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

Features of DIPIPM? series

• Incorporates an inverter, 3-phase converter and brake circuit in a single package*1
• Provides very small size by using direct wire bonding technology*2
• Mounts short and control power supply voltage drop safeguard as well as analog temperature output function
• Mounts a BSD*3 for P side drive power supply generation.
• Inductance reduction allows decrease of passive components such as noise filters.

    *1 CI (Converter-Inverter) wiring also available having no brake circuit with CIB

    ? (Converter-Inverter-Brake) wiring

    *2 Original technology from our company bonds with direct wires between control IC and IGBT

    *3 BSD: Bootstrap Diode

    ? A high withstanding diode for a bootstrap circuit that creates another voltage from the reference voltage.

It is used in Air conditioners/Washing machines/Refrigerator/AC servo/General-purpose Inverters /Small size motor control.

Mitsubishi Electric Corporation

Tel: 022 6611 6200

Email: reinetsu.business@nb.MitsubishiElectric.co.jp