Industrial Automation Magazine India

Technology for Separation of Adhesive Bonds

Published on : Monday 10-06-2024

mycon GmbH, a sister company of the service company Kipp Umwelttechnik GmbH, develops, manufactures and markets new products and automation technologies.

mycon GmbH has further developed the SplitMaster process, an advanced technology for the separation of adhesive bonds, which is now available in more powerful versions. This innovation significantly contributes to sustainability and the circular economy by enabling the repair and reuse of a wide range of devices.

With specially designed jet nozzles, large-scale deburring can now be performed much faster. Particularly for extremely cold-resistant adhesive bonds that were previously difficult to separate, mycon now offers two new device versions that, according to initial applications, can meet all challenges.

The flexibility of the SplitMaster is also highlighted by the fact that all device versions can be used both manually and automatically. This further development demonstrates mycon's commitment to technological advancements that offer both economic and ecological benefits.

mycon GmbH, a sister company of the service company Kipp Umwelttechnik GmbH, develops, manufactures and markets new products and automation technologies. Many years of experience in the field of industrial services led to several system developments and patents, some of which have received international recognition.

mycon GmbH, Germany. Email: [email protected]