Industrial Automation Magazine India

Opportunity to learn more about hyperspectral imaging, spectroscopy, new technology and applications for CMOS detectors, requirements for thermal sensitivity, etc.

Trenton, NJ, USA, January 24, 2024 – Teledyne will showcase their newest products and solutions at SPIE's Photonics West exhibition taking place January 30th – February 1st, 2024, in San Francisco, California.

Visitors to the Teledyne booth #327 can expect representation from the businesses within its Imaging group, including Teledyne DALSA, e2v, FLIR, Acton Optics, Judson, Lumenera, Photometrics, and Princeton Instruments.

New products introduced include:

Teledyne e2v announces OnyxMax™, the next generation of its popular Onyx 1.3M low light CMOS image sensor. This new sensor has been designed for extremely low light conditions, down to 1 mLux. The combination of sensitivity and image resolution increases its range, allowing even small objects to be detected in harsh conditions. This makes OnyxMax ideal for a wide range of applications including science, defense, traffic cameras, broadcast, surveillance, border control and astronomy.

Teledyne Photometrics releases the Retiga E9 camera that can capture exposures from tens of microseconds to tens of minutes, delivering detailed, high-resolution images without extraneous noise. With its stacked CMOS sensor technology developed by Sony, the E9's square pixel array with 3.76 µm pixels and high dynamic range (>80 dB) combine to create a sensitive, versatile, and cost-effective low noise camera ready for integration or benchtop use.

Teledyne FLIR IIS introduces the new Dragonfly® S USB3 series designed to accelerate the inception stage of imaging application development. The Dragonfly S series addresses the essential need of a modular, compact, and lightweight camera for at-scale manufacturing, volume-based applications, and multi-camera systems.

Stop by to learn more about hyperspectral imaging, spectroscopy, new technology and applications for CMOS detectors, requirements for thermal sensitivity, comparisons of 3D sensors, and more. Our product specialists will be available to discuss your specific requirements.