Industrial Automation Magazine India

Chatsworth Products to exhibit integrated cabinet solution for direct-on-chip dielectric liquid cooling at Data Center World 2023

Published on : Friday 05-05-2023

Companys ZetaFrame™ Cabinet System will include ZutaCores direct-on-chip, dielectric liquid cooling solution to demonstrate compatibility.

Simi Valley, Calif., May 2, 2023 – Chatsworth Products (CPI), a leading, global manufacturer of products and solutions that power and protect its customers ever-growing investment in information and communications technology (ICT), will attend and exhibit a full array of data center infrastructure solutions at the AFCOM 2023 Data Center World Conference in Austin, TX, May 8-11, 2023.

Among the products on display in CPI booth 805 will be the companys flagship data center cabinet solution, the ZetaFrame™ Cabinet System, specially outfitted with a dielectric liquid cooling solution from ZutaCore®, whose HyperCool® solution uses a two-phase, waterless, direct-on-chip method of removing heat away from the processors. As workloads cause the processors to heat, the dielectric liquid absorbs the heat causing the liquid to boil and vaporize. The state change from a liquid to a gas is a highly efficient mechanism to remove the heat, which is then expelled outside of the data center or used via heat re-use applications enabling zero emissions.

Such advancements will help usher in a more sustainable and environmentally-friendly technology infrastructure.

This innovative proof-of-concept hardware demonstration comes at a time when emerging technologies such as artificial intelligence and high-performance computing are driving an increased need for more energy efficient methods of cooling and power consumption. Across the data center industry, such advancements are poised to help usher in a more sustainable, environmentally-friendly and carbon neutral technology infrastructure.

The hardware integration, made possible by ZetaFrames industry-leading 4,000 lb. dynamic load rating for an interior payload, supports a fully integrated rack containing ZutaCore components and enables secure transport of a loaded rack and cooling system when used in conjunction with a shock pallet. These components include the ZutaCore HyperCool manifold that easily mounts to CPIs dual vertical power distribution unit (PDU) bracket using button mount features and a heavy-duty shelf support with transportation tie-down brackets for the ZutaCore HyperCool heat rejection unit (HRU). The unique setup also allows for easy integration of CPIs popular, eConnect® Power Distribution Units (PDUs), standard ZetaFrame cable management and airflow management accessories.

Were excited to share this new technology capability with Data Center World attendees, says CPIs Director of Product Management and Hyperscale Business Development, Todd Schneider. Not only does it demonstrate CPIs expertise for designing solutions that scale to support todays most modern liquid cooling technologies, but it also confirms the high degree of configurability and strength that makes ZetaFrame an ideal choice for integrators looking to ship and deploy complete solutions.

Additionally, CPIs presence at this years Data Center World will be further amplified as a participating technology sponsor in a specially billed Rack and Stack Competition. The special session, happening Tuesday, May 9 in the conference expo hall, will host a bracket-style championship to determine who is the best and fastest Racker and Stacker when it comes to dressing a fully-configured and functional data center stack.