Industrial Automation Magazine India

Keysight introduces massively parallel board test system

Published on : Monday 15-02-2021

Delivers small form factor for high volume – consumer electronics, IoT devices, consumer medical and automotive products.

Santa Rosa, Calif., February 2021 – Keysight Technologies, a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, has introduced the new i7090 massively parallel board test system. This is a new category of automated test equipment designed to perform tests in parallel, on multiple printed circuit board assemblies (PCBA), to achieve high volume throughput which speeds time-to-market and reduces cost-of-test.

Current systems on the market only support up to four cores in parallel. Customers need to test and purchase more systems to meet manufacturing demands, incurring scale and infrastructure costs, a larger footprint and additional labour for support and maintenance.

Keysight’s new massively parallel board test system supports up to 20 cores in parallel with PCI eXtensions for Instrumentation (PXI) based in-circuit test capability. As a result, core configuration is variable and not confined to a fixed number of rows, which reduces overall computing costs. To expand functionality, Keysight OpenTAP support enables open platforms for integration of hardware. As needed, and with extensible instrumentation and pin cards, users can easily scale resources.

“Massively parallel computation cores enable modern computers to deliver breakthrough performance. The i7090 board test system brings a similar capability into printed circuit board assembly (PCBA) manufacturing test and programming,” said Christopher Cain, vice president of Keysight’s Electronic Industrial Products. “The i7090 has an innovative modular architecture that delivers breakthrough throughput in a small footprint. It is infused with state-of-the-art Industry 4.0 automation and analytics to deliver unparalleled capability that can be optimized for a broad variety of high-volume PCBA manufacturing challenges.”