Henkel liquid thermal gap filler accelerates dispensing, reduces contamination risk
Published on : Tuesday 17-11-2020
High thermal conductivity, controlled volatility material maximises heat dissipation and alleviates outgassing concerns.

November 2020 – Bergquist Gap Filler TGF 4500CVO is a liquid, gap filling thermal interface material that accelerates dispensing, reduces contamination risk and improves reliability.
Bergquist Gap Filler TGF 4500CVO is a liquid, gap filling thermal interface material that accelerates dispensing, reduces contamination risk and improves reliability.
Recognizing the requirement in many market sectors for thermal interface materials (TIMs) that can enhance processability while complying with increasingly challenging performance and cost metrics, Henkel has leveraged a new formulation approach in the development of Bergquist Gap Filler TGF 4500CVO. The liquid, gap filling thermal interface material dramatically improves on conventional TIM dispensing speeds, while simultaneously delivering high thermal conductivity of 4.5 W/m-K in a controlled volatility product. Balancing viscosity, high thermal conductivity and controlled volatile outgassing is a challenging formulation achievement, but Bergquist Gap Filler TGF 4500CVO successfully delivers these attributes in a material with low-stress, silicone-like mechanical properties.
As Justin Kolbe, Henkel Director of Market Strategy for Power and Industrial Automation, notes, highly-filled, high thermal conductivity liquid TIMs have complex rheologies and are often challenging to dispense quickly. “Among other characteristics, Bergquist Gap Filler TGF 4500CVO resolves the dispensing rate dilemma with excellent processability, no separation and good print fidelity,” he says, explaining that normally fast deposition or high thermal conductivity are binary formulation choices. “New Henkel resin and filler innovation has allowed an ‘all of the above’ scenario in a material that secures low cost of ownership alongside reduced siloxane contamination risk.”